This product complies with the RoHS Directive (EU 2002/95/EC). FJ330301 Silicon P-channel MOS FET For switching circuits Overview Package FJ330301 is P-channel small signal MOS FET employed small size surface mounting package. Code SSSMini3-F2-B Pin Name 1: Gate 2: Source 3: Drain Features Low drain-source ON resistance: RDS(on) typ. = 4 W (VGS = -4.0 V) High-speed switching Small size surface mounting package: SSSMini3-F2-B Contributes to miniaturization of sets, reduction of component count. Eco-friendly Halogen-free package Marking Symbol: U1 Internal Connection Packaging Embossed type (Thermo-compression sealing): 10000 pcs / reel (standard) (D) 3 Absolute Maximum Ratings Ta = 25C Parameter Symbol Rating Unit Drain-source surrender voltage VDSS -30 V Gate-source surrender voltage VGSS 12 V Drain current ID -100 mA Peak drain current IDP -200 mA Power dissipation PD 100 mW Channel temperature Tch 150 C Storage temperature Tstg -55 to +150 C Publication date: January 2011 Ver. CED 1 (G) 2 (S) 1 This product complies with the RoHS Directive (EU 2002/95/EC). FJ330301 Electrical Characteristics Ta = 25C3C Parameter Symbol Conditions Min Typ Max Unit Drain-source surrender voltage VDSS ID = -1 mA, VGS = 0 Drain-source cutoff current IDSS VDS = -30 V, VGS = 0 -1.0 mA Gate-source cutoff current IGSS VGS = 10 V, VDS = 0 10 mA Gate threshold voltage VTH ID = -1.0 mA, VDS = -3.0 V - 1.0 -1.5 V ID = -10 mA, VGS = -2.5 V 7 17 W ID = -10 mA, VGS = -4.0 V 4 7 W Drain-source ON resistance RDS(on) Forward transfer admittance Yfs V -30 - 0.5 ID = -10 mA, VDS = -3 V 20 40 mS 12 pF 7 pF 3 pF Short-circuit input capacitance (Common source) Ciss Short-circuit output capacitance (Common source) Coss Reverse transfer capacitance (Common source) Crss Turn-on time * ton VDD = -3 V, VGS = 0 V to -3 V, ID = -10 mA 100 ns Turn-off time * toff VDD = -3 V, VGS = -3 V to 0 V, ID = -10 mA 100 ns VDS = -3 V, VGS = 0, f = 1 MHz Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Test circuit VDD = -3 V VGS = 0 V to -3 V VIN G ID = -10 mA RL = 300 VOUT D VOUT 50 S 2 VIN 10% 90% 90% 10% td(on) tr Ver. CED td(off) tf This product complies with the RoHS Directive (EU 2002/95/EC). FJ330301 FJ330301_ ID-VDS VDS = -3 V VGS = -4.5 V -10 Drain current ID (mA) -2.5 V -60 -40 25C -10-1 -20 0 Ta = 85C -1 0 - 0.1 - 0.2 - 0.3 - 0.4 -30C -10-2 -1.5 V - 0.5 -10-3 0 Drain-source voltage VDS (V) - 0.5 10 1 -2.0 0 -4.0 V 1 10-1 -10-1 -1 80 -102 60 40 0 0 40 80 120 Drain current ID (mA) Ambient temperature Ta (C) FJ330301_Ciss , Crss , Coss -VDS FJ330301_|Yfs|-ID Ciss , Crss , Coss VDS 25 -10 Ta = 25C Glass epoxy board (25.4 mmx 25.4 mm x t0.8 mm) coated with copper foil, which has more than 300 mm2. Limited by RDS(on) = 7 (max) (VGS = -4.0 V) 10 ms 1s 100 ms DC -10 20 -102 -10 -8 IDP = - 0.2 A Drain current ID (mA) VGS = -2.5 V -6 Safe operation area -103 100 10 -4 Area of safe operation for the FJ330301 120 Ta = 25C -2 Gate-source voltage VGS (V) PD Ta Power dissipation PD (mW) Drain-source ON resistance RDS(on) () 102 FJ330301_ PD-Ta RDS(on) ID 160 -1 -2 -10 -10-1 -1 -10 -102 Drain-source voltage VDS (V) Yfs ID 1 Ta = 25C Forward transfer admittance |Yfs | (S) Short-circuit input capacitance (Common source) Ciss , Reverse transfer capacitance (Common source) Crss , Short-circuit output capacitance (Common source) Coss (pF) -1.5 Ta = 25C ID = 0.01 A Gate-source voltage VGS (V) FJ330301_ RDS(on)-ID 102 -1.0 RDS(on) VGS 103 -102 Ta = 25C -80 FJ330301_ RDS(on)-VGS ID VGS Drain-source ON resistance RDS(on) () -100 Drain current ID (mA) FJ330301_ ID-VGS ID VDS 20 Ta = 25C VDS = -3 V 10-1 15 Ciss 10 10-2 Coss 5 0 Crss 0 -5 -10 -15 Drain-source voltage VDS (V) -20 10-3 -1 -10 -1 -10 -102 Drain current ID (mA) Ver. CED 3 This product complies with the RoHS Directive (EU 2002/95/EC). FJ330301 SSSMini3-F2-B Unit: mm 0.20 0.05 1.20 0.05 +0.05 0.30 -0.02 (5) 1.20 0.05 0.80 0.05 3 2 1 +0.05 0.20 -0.02 (0.4) +0.05 0.13 -0.02 (0.4) (0.27) 0.80 0.05 0 to 0.05 0.52 0.03 (5) 4 Ver. CED Request for your special attention and precautions in using the technical information and semiconductors described in this book (1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. (2) The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products. No license is granted in and to any intellectual property right or other right owned by Panasonic Corporation or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for general applications (such as office equipment, communications equipment, measuring instruments and household appliances), or for specific applications as expressly stated in this book. Consult our sales staff in advance for information on the following applications: - Special applications (such as for airplanes, aerospace, automotive equipment, traffic signaling equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. It is to be understood that our company shall not be held responsible for any damage incurred as a result of or in connection with your using the products described in this book for any special application, unless our company agrees to your using the products in this book for any special application. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. 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